Research on Heat Transfer Characteristics of Air Cooling Plate Embedded with Heat Pipes-Reference-Cited by-同舟云学术

Research on Heat Transfer Characteristics of Air Cooling Plate Embedded with Heat Pipes

Published:2019-08-31 Issue: Volume: Page:509-517
ISSN:1876-1100
Container-title:Lecture Notes in Electrical Engineering
language:
Short-container-title:

Author:

Xu Jiyuan,Qian Jiyu

Publisher

Springer Singapore

Link

http://link.springer.com/content/pdf/10.1007/978-981-32-9441-7_52

Reference8 articles.

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2. Lee, T.Y.: Design optimization of an integrated liquid-cooled IGBT power module using CFD technique. IEEE Trans. Compon. Packag. Technol. 23(1), 55–60 (2000)

3. Garimella, S.V., Fleischer, A.S., Murthy, J.Y., et al.: Thermal challenges in next-generation electronic systems. Compon. Packag. Technol. 31(4), 801–815 (2008)

4. Schuh, P., Sledzik, H., Reber, R., et al.: T/R-Module technologies today and future trends. In: 2010 European Microwave Conference, pp. 1540–1543. IEEE (2010)

5. Baranyuk, A.V., Nikolaenko, Y.E., Rohachov, V.A., Terekh, A.M., Krukovskiy, P.G.: Investigation of the flow structure and heat transfer intensity of surfaces with split plate finning. Therm. Sci. Eng. Progress 11, 28–39 (2019)

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2. Increasing Performance of Cooling Systems for Radar Transmit/Receive Modules;2022 IEEE 41st International Conference on Electronics and Nanotechnology (ELNANO);2022-10-10

3. Study on the Performance of the Low-Cost Cooling System for Transmit/Receive Module and Broadening the Exploitative Capabilities of the System Using Gravity Heat Pipes;Journal of Thermal Science and Engineering Applications;2022-08-23

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