Hybrid Solid State/Fluidic Cooling for Hot Spot Removal-Reference-Cited by-同舟云学术

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Hybrid Solid State/Fluidic Cooling for Hot Spot Removal

Published:2009-07-30 Issue:3 Volume:13 Page:135-150
ISSN:1556-7265
Container-title:Nanoscale and Microscale Thermophysical Engineering
language:en
Short-container-title:Nanoscale and Microscale Thermophysical Engineering

Author:

Sahu Vivek,Joshi Yogendra K.,Fedorov Andrei G.

Publisher

Informa UK Limited

Subject

Mechanics of Materials,Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics

Link

http://www.tandfonline.com/doi/pdf/10.1080/15567260903058033

Reference14 articles.

1. Hot spot cooling using embedded thermoelectric coolers

2. Heterostructure integrated thermionic coolers

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimization and Numerical Investigation of Micro-pin-Fin Structure on Heat Sink with Checkerboard Nozzles;Lecture Notes in Electrical Engineering;2023

2. A silicon-diamond microchannel heat sink for die-level hotspot thermal management;Applied Thermal Engineering;2021-07

3. High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films;ACS Nano;2021-04-28

4. A novel composite pinfin heat sink for hotspot mitigation;International Journal of Heat and Mass Transfer;2020-08

5. Experimental investigation of using thermoelectric cooling for computer chips;Journal of King Saud University - Engineering Sciences;2020-07

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