Thermal Analysis of Different Components on the PCB Using ANSYS Software-Reference-Cited by-同舟云学术

Thermal Analysis of Different Components on the PCB Using ANSYS Software

Published:2022-09-16 Issue: Volume: Page:147-156
ISSN:2524-7565
Container-title:Cybernetics, Cognition and Machine Learning Applications
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Author:

Sanjitha K.,Panduranga V.,Mallesh S.

Publisher

Springer Nature Singapore

Link

https://link.springer.com/content/pdf/10.1007/978-981-19-1484-3_17

Reference15 articles.

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4. Zhan Y, Kumar SV, Sapatnekar SS (2007) Thermally aware design. In: Foundations and trends R in electronic design automation, vol 2(3), pp 255–370

5. Li RS, Larson SE (2000) An approach to thermal analysis of PCB with components having cyclic electrical loading. In: The proceedings of ITHERM 2000 conference

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