Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process-Reference-Cited by-同舟云学术

Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process

Published:2014-11-11 Issue:12 Volume:39 Page:9101-9111
ISSN:1319-8025
Container-title:Arabian Journal for Science and Engineering
language:en
Short-container-title:Arab J Sci Eng

Author:

Abdul Aziz M. S.,Abdullah M. Z.,Khor C. Y.,Jalar A.,Bakar M. A.,Yusoff W. Y. W.,Che Ani F.,Yan N.,Zhou M.,Cheok C.

Publisher

Springer Science and Business Media LLC

Subject

Multidisciplinary

Link

http://link.springer.com/content/pdf/10.1007/s13369-014-1457-0.pdf

Reference23 articles.

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3. Kuo C-H., Hua H-H., Chan H-Y., Yang T-H., Lin K-S., Ho C-E.: Interfacial reaction and mechanical reliability of PTH solder joints with different solder/surface finish combinations. Microelectron. Reliab. 53(12), 2012–2017 (2013)

4. Suganuma K., Ueshima M., Ohnaka I., Yasuda H., Zhu J., Matsuda T.: Lift-off phenomenon in wave soldering. Acta Mater. 48(18–19), 4475–4481 (2000)

5. Wang, J.; Wei, X.; Zhu, W.; Wu, J.; Wu, N.: Study on low silver Sn–Ag–Cu–P alloy for wave soldering. In: Proceedings of 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2013, Suzhou, China, Article number 6599206, pp. 485-489 (2013)

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