Publisher
Springer Science and Business Media LLC
Reference41 articles.
1. Otani, S.; Tanaka, O.: High power semi conductor rectifier equipment using boiling and condensing heat transfer. In: Proceedings of 10th IAS Conference, pp. 46–52 (1975)
2. EPP staff report: Considerations in device cooling. Electron. Package Prod. 21, 304–311 (1981)
3. Peterson, G.P.; Alfonso, O.: Thermal Control of Electronic Equipment. Advances in Heat Transfer, vol. 20, pp. 181–314. Academic Press, New York (1990)
4. Du Toit C.G.: Segregated finite element solution for non-isothermal flow. Comput. Methods Appl. Mech. Eng. 182(3–4), 457–481 (2000)
5. Spiga M., Morini G.L.: Laminar heat transfer between parallel plates as limiting solution for rectangular duct. Int. Commun. Heat Mass Transfer 23, 555–562 (1996)
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献