Performance of Carbon Nanotube on Nickel-Plated Copper Substrate Using Electrophoretic Deposition Process for Electronic Cooling Application: Response Surface Method Optimization
Author:
Funder
Universiti Tenaga Nasional
Geran Galakan Penyelidik Muda
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s13369-024-08722-2.pdf
Reference47 articles.
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3. Hansson, J., et al.: Novel nanostructured thermal interface materials: a review. Int. Mater. Rev. 63(1), 22–45 (2018)
4. Bahru, R.; Hamzah, A.A.; Mohamed, M.A.: Thermal management of wearable and implantable electronic healthcare devices: perspective and measurement approach. Int. J. Energy Res. 45(2), 1517–1534 (2021)
5. Chow, J.; Sitaraman, S.K.: Electroplated copper nanowires as Thermal Interface Materials. In: 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (2016)
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