Argon Versus Helium Dielectric Barrier Discharge for Surface Modification of Polypropylene and Poly(methyl methacrylate) Films-Reference-Cited by-同舟云学术

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Argon Versus Helium Dielectric Barrier Discharge for Surface Modification of Polypropylene and Poly(methyl methacrylate) Films

Published:2013-02-05 Issue:3 Volume:33 Page:553-568
ISSN:0272-4324
Container-title:Plasma Chemistry and Plasma Processing
language:en
Short-container-title:Plasma Chem Plasma Process

Author:

Chiper A.,Borcia G.

Publisher

Springer Science and Business Media LLC

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,General Chemical Engineering,General Chemistry

Link

http://link.springer.com/content/pdf/10.1007/s11090-013-9442-z.pdf

Reference27 articles.

1. d’Agostino R (ed) (1990) Plasma deposition, treatment, and etching of polymers. Academic Press, New York

2. Strobel M, Lyons CS, Mittal KL (eds) (1995) Plasma surface modification of polymers: relevance to adhesion. VSP, Zeist

3. Inagaki N (ed) (1996) Plasma surface modification and plasma polymerization. Technomic, Basel

4. Denes FS, Manolache S (2004) Prog Polym Sci 29:815

5. Choudhury AJ et al (2011) Prog Org Coat 70:75

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