Interaction Mechanisms Between Ar–O2 Post-Discharge and Stearic Acid I: Behaviour of Thin Films-Reference-Cited by-同舟云学术

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Interaction Mechanisms Between Ar–O2 Post-Discharge and Stearic Acid I: Behaviour of Thin Films

Published:2010-11-04 Issue:1 Volume:31 Page:189-203
ISSN:0272-4324
Container-title:Plasma Chemistry and Plasma Processing
language:en
Short-container-title:Plasma Chem Plasma Process

Author:

Bernardelli E. A.,Belmonte T.,Duday D.,Frache G.,Poncin-Epaillard F.,Noël C.,Choquet P.,Migeon H.-N.,Maliska A.

Publisher

Springer Science and Business Media LLC

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,General Chemical Engineering,General Chemistry

Link

http://link.springer.com/content/pdf/10.1007/s11090-010-9263-2.pdf

Reference40 articles.

1. Wertheimer MR, Fozza AC, Holländer A (1999) Nucl Instrum Methods Phys Res Sect B 151:65–75

2. Baránková H, Bardos L (2006) Vacuum 80:688–692

3. Hsieh JH, Li C (2006) Thin Solid Films 504:101–103

4. Gupta P, Tenhundfeld G, Daigle EO, Ryabkov D (2007) Surf Coat Technol 201:8746–8760

5. Ferreira JA, Tabarés FL, Tafalla D (2007) J Nucl Mat 363–365:888–892

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