The effect of post-implantation annealing temperature on the deep states present in SIMOX MOSFET’s as observed using enhancement mode current DLTS

Author:

McLarty P. K.,Ioannou D. E.,Hughes H. L.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference18 articles.

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2. K. Das, G. Shorthouse, J. Butcher and K. V. Armand, Microelectron.J.14, (1983).

3. J. Y. Lee, D. C. Meyer and P. K. Vasudev, Microelectron J.14, 5 (1983).

4. J. Margail, I. Stoemenos, C. Jaussaud, M. Dupuy, P. Martin, B. Blanchard and M. Bruel, in Energy beam Solid Interactions and Transient Thermal Processing, Ed. V. T. Nguyen and A. G. Cullis (Les Editions de Physique, Les Ulis) p. 519 (1986).

5. B. Y Mao, M. Matloubain, C. E. Chen, R. Sundaresan and C. Slawinski, IEEE Electron Device Lett. EDL-8, 306 (1987).

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1. Effect of High‐Temperature Annealing on Deep Levels in Thin Silicon‐on‐Insulator Layers Separated by Implanted Oxygen;Journal of The Electrochemical Society;1999-09-01

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3. High-dose oxygen ion implanted heterointerfaces in silicon;Ion Beam Modification of Materials;1996

4. High-dose oxygen ion implanted heterointerfaces in silicon;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1995-12

5. The kink-related excess low-frequency noise in silicon-on-insulator MOST's;IEEE Transactions on Electron Devices;1994-03

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