Influence of Interdiffusion in Sn Solution on Growth of Cu3Sn and Cu6Sn5 Formed in Semi-infinite and Finite Cu-Sn Diffusion Couples
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s11669-016-0507-6.pdf
Reference37 articles.
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3. A. Paul, A.A. Kodentsov, and F.J.J. van Loo, Intermetallic growth and Kirkendall effect manifestations in Cu/Sn and Au/Sn diffusion couples, Z. Metallkd., 2004, 95, p 913-920
4. T. Takenaka, S. Kanoa, M. Kajihara, N. Kurokawa, K. Sakamoto, Growth Behavior of Compound Layers in Sn/Cu/Sn Diffusion Couples During Annealing at 433-473 K, Mater. Sci. Eng., 2005, A 396, p 115-123
5. W.-M. Tang, A.-Q. He, Q. Liu, and D.G. Ivey, Solid State Interfacial Reactions in Electrodeposited Cu/Sn Couples, Trans. Nonferrous Met. Soc. China, 2010, 20, p 90-96
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