Hydrogen Ion Implantation Induced Cutting Behavior Variation in Plunge Cutting of the Monocrystalline Silicon-Reference-Cited by-同舟云学术

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Hydrogen Ion Implantation Induced Cutting Behavior Variation in Plunge Cutting of the Monocrystalline Silicon

Published:2021-01-28 Issue:4 Volume:4 Page:209-215
ISSN:2520-811X
Container-title:Nanomanufacturing and Metrology
language:en
Short-container-title:Nanomanuf Metrol

Author:

Zhao Zejia^ORCID,Jelenković E. V.,Xiao Gaobo,Zhuang Zhuoxuan,To Suet

Funder

Hong Kong Polytechnic University

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Materials Science (miscellaneous)

Link

https://link.springer.com/content/pdf/10.1007/s41871-020-00086-z.pdf

Reference26 articles.

1. Fang F, Wu H, Zhou W, Hu X (2007) A study on mechanism of nano-cutting single-crystal silicon. J Mater Process Technol 184:407–410

2. Liu K, Wang H, Zhang XQ (2020) Ductile mode cutting of brittle materials. Springer, Berlin

3. Goel S, Luo X, Agrawal A, Reuben RL (2015) Diamond machining of silicon: a review of advances in molecular dynamics simulation. Int J Mach Tools Manuf 88:131–164

4. Leung T, Lee W, Lu X (1998) Diamond turning of silicon substrates in ductile-regime. J Mater Process Technol 73:42–48

5. Arif M, Rahman M, San WY (2012) A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries. Int J Adv Manuf Technol 63:481–504

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4. Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon;Journal of Manufacturing Science and Engineering;2021-10-19

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