Effect of Substrate Temperature on Deposition Behavior of Copper Particles on Substrate Surfaces in the Cold Spray Process-Reference-Cited by-同舟云学术

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Effect of Substrate Temperature on Deposition Behavior of Copper Particles on Substrate Surfaces in the Cold Spray Process

Published:2007-10-13 Issue:5-6 Volume:16 Page:643-650
ISSN:1059-9630
Container-title:Journal of Thermal Spray Technology
language:en
Short-container-title:J Therm Spray Tech

Author:

Fukumoto M.,Wada H.,Tanabe K.,Yamada M.,Yamaguchi E.,Niwa A.,Sugimoto M.,Izawa M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Surfaces, Coatings and Films,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11666-007-9121-9.pdf

Reference12 articles.

1. H. Choi, S. Yoon, S. Uhm, C. Lee, Characterization of The Spraying Beads Deposited by the Kinetic Spraying Process, Surf. Coat. Technol., 2005, 192, p 374-381

2. J. Wu, H. Fang, S. Yoon, H. Kim, C. Lee, Measurement of Particles Velocity and Characterization of Deposition in Aluminum Alloy Kinetic Spraying Process, Appl. Surf. Sci., 2005, 252, p 1368-1377

3. S. Yoon, H.J. Kim, C. Lee, Deposition Behavior of Bulk Amorphous NiTiZrSiSn According to the Kinetic and Thermal Energy Levels in The Kinetic Spraying Process, Surf. Coat. Technol., 2006, 200, p 6022-6029

4. C. Borchers, F. Gartner, T. Stoltenhoff, H. Assadi, H. Kreye, Microstructural and Macroscopic Properties of Cold Sprayed Copper Coatings, J. Appl. Phys., 2003, 93(12), p 10064-10070

5. C.J. Li, W.Y. Li, Y.Y. Wang, Formation of Metastable Phases in Cold-Sprayed Soft Metallic Deposit, Surf. Coat. Technol., 2005, 198, p 469-473

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