The effects of underfill on the reliability of flip chip solder joints-Reference-Cited by-同舟云学术

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The effects of underfill on the reliability of flip chip solder joints

Published:1999-09 Issue:9 Volume:28 Page:1017-1022
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Su Peng,Rzepka Sven,Korhonen Matt,Li C. Y.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-999-0178-8.pdf

Reference13 articles.

1. “Semiconductor Resin Package Structure,” U.S. patent 4,825,284 (1989).

2. T. Soga, F. Nakano, and M. Fuyama, Trans. of the Institute of Electron., Information and Communication Engineers C J70C 12, 1575 (1987).

3. T.Y. Wu, Y. Tsukada, and W.T. Chen, Proc. ECTC (1996), p. 524.

4. F. Feustel et al., Proc. 48th ECTC (1998), p. 427.

5. D. Suryanarayana et al., Proc. ECTC (1990), 338.

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1. Warpage behavior of the flip chip package in underfill curing process: in situ characterization and numerical simulation;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Strain evolution of flip-chip package with underfill during thermal cycling and high temperature isothermal aging;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Failures of Cu-Cu Joints under Temperature Cycling Tests;Materials;2022-07-15

4. The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints;Materials;2019-03-22

5. Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-03

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