TiN coatings on copper and phosphor-bronze plates by the CVD process, and their oxidation and corrosion stabilities-Reference-Cited by-同舟云学术

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TiN coatings on copper and phosphor-bronze plates by the CVD process, and their oxidation and corrosion stabilities

Published:1988-10 Issue:10 Volume:23 Page:3435-3439
ISSN:0022-2461
Container-title:Journal of Materials Science
language:en
Short-container-title:J Mater Sci

Author:

Motojima Seiji,Mizutani Hidetoshi

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF00540475.pdf

Reference26 articles.

1. E. I. Meletis and W. B. Carter, Microstruct. Sci. 13 (1986) 417.

2. M. Matsumura, Y. Oka, T. Odohira, R. Ebara, T. Wada and H. Nakajima, Nippon Kinzoku Kakkaishi 51 (1987) 419.

3. M. Kishi, A. Watanabe and R. Shimoyama, Kinzoku Hyomen Gijutsu 35 (1984) 50.

4. A. Matthews and D. G. Teer, Thin Solid Films 72 (1980) 541.

5. A. Armigliato, G. Celotti, A. Garulli, S. Guerri, P. Ostoja and R. Rosa, ibid. 92 (1982) 341.

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2. Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier;Journal of Electronic Materials;2009-08-28

3. Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates;Journal of Electronic Materials;2009-04-10

4. High-temperature lead-free solders: Properties and possibilities;JOM;2009-01

5. Modeling of Laser Chemical Vapor Deposition of Thin Films;Laser Processing: Surface Treatment and Film Deposition;1996

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