Author:
Gaoua Said,Asadi Shahrooz,Yagoub Mustapha C. E.,Mohammadi Farah A.
Publisher
Springer Science and Business Media LLC
Subject
Surfaces, Coatings and Films,Hardware and Architecture,Signal Processing
Reference37 articles.
1. Cornett, K. D. (2000). A wireless R&D perspective on RF/IF passives integration. IEEE Bipolar/Bicmos Circuits and Technical Meeting, Minneapolis, MN, pp. 187–190.
2. Tummala, R. R., Swaminathan, M., Tentzeris, M. M., Laskar, J., Chang, G.-K., Sitaraman, S., et al. (2004). The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade. IEEE Transactions on Advanced Packaging, 27, 250–267.
3. Uchida, K. (2006). Single-electron transistors and circuits for future ubiquitous computing applications. European Solid-State Device Research Conference, Montreux, Switzerland, pp. 17–20.
4. Mashkantsev, V. G., & Kalinin, S. V. (2006). The perspective structures for microwave heterotransistors for communication techniques. International Workshop on Electron Devices and Materials, Novosibirsk, Russia, pp. 24–26.
5. Razavi, B. (2007). Design considerations for future RF circuits. IEEE International CAS-Symposium, New Orleans, LA, pp. 741–744.
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