1. S.J. Holden and E.R. Wallach: Int. J. Microcircuits Electronic Packaging, 1999, vol. 22, pp. 80–85.
2. U.D. Perera: Microelectr. Reliability, 1999, vol. 39, pp. 391–99.
3. L. Leichti and A. Skipor: Int. J. Microcircuits Electronic Packaging, 1999, vol. 22, pp. 57–61.
4. C.H. Zhong and S. Yi: Soldering Surface Mount Technol., 1999, vol. 11, pp. 44–48.
5. Q. Yu and M. Shiratori: IEEE Trans. Components, Packaging Manufacturing Technol. Part A, 1997, vol. 20, pp. 266–73.