Life cycle assessment of integrated circuit packaging technologies

Author:

Andrae Anders S. G.,Andersen Otto

Publisher

Springer Science and Business Media LLC

Subject

General Environmental Science

Reference32 articles.

1. Alcatel-Lucent (2008) Lifecycle assessments of telecom products—process and results. Tom Okrasinski at iNEMI Sept. 22

2. Andersson C (2007) Reliability, fatigue, and mechanical characterisation of lead-free solders for electronic packaging applications. Ph. D. thesis, Chalmers University of Technology. Gothenburg, Sweden

3. Andrae ASG (2009) Global life-cycle impact assessment of material shifts: the example of a Pb-free electronics industry. Springer UK, London

4. Andrae ASG, Andersen O (2010) Life cycle assessments of consumer electronics—are they consistent? Int J Life Cycle Assess 15:827–836

5. Boyd SB, Horvath A, Dornfeld D (2009) Life-cycle energy demand and global warming potential of computational logic. Environ Sci Technol 43:7303–7309

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