Thermal physical properties of Al-coated diamond/Cu composites
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Materials Science
Link
http://link.springer.com/content/pdf/10.1007/s11595-015-1146-1.pdf
Reference18 articles.
1. Shen WP, Shao WJ, Wang Q, et al. Thermal Conductivity And Thermal Expansion Coeffient Of Diamond/5wt%Si-Cu Composite By Vacuum Hot Pressing [J]. Fusion Engineering and Design, 2010, 85:2 237–2 240
2. Ekimov EA, Suetin NV, Popovich AF, et al. Thermal Conductivity Of Diamond Composites Sintered Under High Pressures [J]. Diamond & Related Material, 2008, 17:838–843
3. Chu K, Liu ZF, Jia CC, et al. Thermal Conductivity Of SPS Consolidated Cu/diamond Composites With Cr-coated Diamond Particles [J]. Journal of Alloys and Compounds, 2010, 490:453–458
4. Pamela J, Becoulet A, Borba D, et al. Efficiency And Availability Driven R&D Issues For DEMO [J]. Fusion Engineering and Design, 2009, 84:194–204
5. Escourbiac F, Constans S, Vignal NV, et al. Experimental Acticity On The Definition Of Acceptance Criteria For The ITER Divertor Plasma Facing Components [J]. Fusion Engineering and Design, 2009, 84:747–751
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