1. Armstrong, L. D.; Kingston, R. S. T. 1962: The effect of moisture content changes on the deformation of wood under stress. Aust. J. Appl. Sci. 13:257?276
2. Bolton, A. J.; Jardine, P.; Vine, M. H.; Walker, J. F. 1974: The swelling of wood under mechanical restraint. Holzforschung 28:138?144
3. Bryan, E. L.; Schniewind, A. P. 1965: Strength and rheological properties of particle boards as affected by moisture content and sorption. Forest. Prod. J. 15: 143?148
4. Carslaw, H. S.; Jaeger, J. C. 1959. Conduction of heat in solids. 2nd ed. London: Oxford Univ. Press
5. Chomcharn, A. 1975: Transverse hygroexpansion of wood wafers under sinusoidally varying relative humidity. Ph.D. Thesis. SUNY Coll. Envir. Sci. and For., Syracuse, N.Y.