A study on recovery of SiC from silicon wafer cutting slurry
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanics of Materials,Waste Management and Disposal
Link
http://link.springer.com/article/10.1007/s10163-017-0591-7/fulltext.html
Reference21 articles.
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2. Nishijima S, Izumi Y, Takeda SI, Suemoto H, Nakahira A, Horie SI (2003) Recycling of abrasives from wasted slurry by superconducting magnetic separation. IEEE Trans Appl Supercon 13:1596–1599
3. Shibata J, Murayama N, Nagae K (2006) Flotation separation of SiC from wastes in the silicon wafer slicing process. Kagaku Kogaku Ronbun 32:93–98
4. Wang TY, Lin YC, Tai CY, Sivakumar R, Rai DK, Lan CW (2008) A novel approach for recycling of kerf loss silicon from cutting slurry waste for solar cell applications. J Cryst Growth 310:3403–3406
5. Tsai TH (2009) Pretreatment of recycling wiresaw slurries-Iron removal using acid treatment and electrokinetic separation. Sep Purif Technol 68:24–29
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