Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration-Reference-Cited by-同舟云学术

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Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration

Published:2011 Issue: Volume: Page:227-253
ISSN:
Container-title:The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
language:
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Author:

Tegehall P.-E.

Publisher

Springer London

Link

http://link.springer.com/content/pdf/10.1007/978-0-85729-236-0_10

Reference56 articles.

1. Ellis BN (1994) The determination of flux residue safety: the state of the art. Circuit World 20(4):26–32

2. IPC-9201 (1996) Surface insulation resistance handbook. IPC http://www.ipc.org

3. IPC-TR-476A (1997) Electrochemical migration: electrically induced failures in printed wiring assemblies IPC. http://www.ipc.org

4. Ellis BN (1995) On insulation resistance. Circuit World 21(2):5–18

5. Osborne AG (1983) Modern thoughts on surface resistance. IPC technical paper IPC-TP-498

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