The Effect of Thermal and Moisture Stress on Insulation Deterioration Law of Ionic Contaminated High-Voltage Printed Circuit Board of Electronic Power Conditioner

Abstract

Since the electronic power conditioner (EPC) is a crucial part applied of a Space Travelling-wave Tube Amplifier (STWTA), the reliability issue must be considered. Of all the failure modes of an EPC, the insulation failure of an EPC in thermal and moist environments is the most serious, and needs special attention. By investigating the influence of contamination, humidity, and temperature on surface insulation resistance (SIR) and surface discharge, we focused on the determination of the insulation failure boundary in an EPC. Considering real working conditions, we used the typical circuit applied in the EPC as the test object. The insulation deterioration phenomenon under different thermal and moisture stress was studied. The results show that: (1) SIR of the samples did not change with contamination levels when the relative humidity (RH) was below 70%. When RH was higher than 75%, the SIR began to vary with temperature and ionic contaminant concentration. (2) Even if the samples were not contaminated (the ionic contamination concentration was less than 1.56 μg/cm2), the deterioration of the SIR still occurred at 85 °C/90% RH. (3) The insulation failure boundary caused by surface discharge, and the degree of electrical erosion were related to humidity, pollution, voltage and temperature. To improve the failure caused by insulation, encapsulation was used. Experiments showed that encapsulation is an effective protection method to prevent insulation deterioration.