Modeling and control of fluid dispensing processes: a state-of-the-art review-Reference-Cited by-同舟云学术

Modeling and control of fluid dispensing processes: a state-of-the-art review

Published:2008-08-26 Issue:3-4 Volume:43 Page:276-286
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Chen X. B.

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/content/pdf/10.1007/s00170-008-1700-5.pdf

Reference33 articles.

1. Quinones H et al (2000) Flip Chip and Chip Scale Packaging Technologies: A Historical Perspective and Future Challenges. SEMICON China 2000 Technical Symposium

2. Han S, Wang KK (1997) Analysis of the flow of encapsulant during underfill encapsulation of flip-chips. IEEE Trans Compon Packag Manuf Technol—Part B 20:424–433

3. Tummala RR, Rymaszewski EJ (1989) Microelectronic packaging handbook. Nostrand_Reinhold, New York

4. Boulanger R (2001) Chapter 41: Assembly Processes, Printed Circuits Handbook, Editor-in-Chief: C. F. Coombs, Mcgraw-Hall

5. Dixon D et al (1997) Practical issues concerning dispensing pump technologies. Circuits Assem 36–40, August

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