Fixed abrasive polishing: the effect of particle size on the workpiece roughness and sub-surface damage-Reference-Cited by-同舟云学术

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Fixed abrasive polishing: the effect of particle size on the workpiece roughness and sub-surface damage

Published:2021-06-03 Issue:9-10 Volume:115 Page:3021-3035
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Luo Xinyu,Yang Wei,Qian Yuan

Funder

National Natural Science Foundation of China

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

https://link.springer.com/content/pdf/10.1007/s00170-021-07363-1.pdf

Reference28 articles.

1. Suratwala TI, Feit MD, Steele WA (2010) Toward deterministic material removal and surface figure during fused silica pad polishing [J]. J Am Ceram Soc 93(5):1326–1340. https://doi.org/10.1111/j.1551-2916.2010.03607.x

2. Li Y (2015) Recent progress in bound-abrasive polishing of fused silica glass [C]. Optifab 2015. Int Soc Optic Photon 9633:963327. https://doi.org/10.1117/12.2197485

3. Ottman J C, Shen J C S (1983) Fixed abrasive polishing method and apparatus: U.S. patent 4,393,628 [P]. 1983-7-19.

4. Der Velden PV (1999) Chemical mechanical polishing with fixed abrasives using different subpads to optimize wafer uniformity [J]. Microelectron Eng 50(1):41–46. https://doi.org/10.1016/S0167-9317(99)00262-2

5. Kim HY, Kim H, Jeong H, Seo H, Lee S (2003) Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing [J]. J Mater Process Technol 142(3):614–618. https://doi.org/10.1016/S0924-0136(03)00641-1

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