Combined effect of the interlayer temperature with travel speed on features of thin wall WAAM under two cooling approaches

Author:

Teixeira Felipe RibeiroORCID,Scotti Fernando MatosORCID,Jorge Vinicius LemesORCID,Scotti AméricoORCID

Abstract

Abstract This work presents the evaluation of the interlayer temperature (IT) with travel speed (TS) combined effect for a given wire feed speed (WFS) on operational, geometrical, and metallurgical features of thin walls with the same width deposited by wire arc additive manufacturing (WAAM) with a low alloy steel, using or not active cooling. A preliminary experimental design was carried out to define a range of IT that could prevent the molten pool from running down and, then, be used in the main experimental design. The main tests were planned and performed to find different IT and TS combinations for a given WFS capable of depositing walls with the same target effective wall width. After selecting the parameters, six walls were deposited, three under natural cooling (NC) and three under near immersion active cooling (NIAC). A more significant temperature variability along the layer length (ΔT/ΔLL) is observed in increasing IT-TS combination and under NIAC. Regardless of the cooling approach, a worse surface aspect was observed with lower IT and TS. However, NC or NIAC do not affect the wall width (effective or external) or the layer height. On the other hand, they are affected by the IT with TS combination. A shorter production time was obtained on the walls with NIAC and higher IT-TS. No marked microstructural differences were observed comparing the walls, regardless of the cooling approach. However, microstructure tempering (hardness reduction) was observed in the walls deposited with NC using higher IT levels.

Funder

Conselho Nacional de Desenvolvimento Científico e Tecnológico

Coordenação de Aperfeiçoamento de Pessoal de Nível Superior

Petrobras

University West

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

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