Controlling coating thickness distribution for a complex geometry with the help of simulation

Abstract

AbstractThis paper aims to develop a proper and valid simulation model for electroplating complex geometries. Since many variables influence the quality of the deposited coating and its thickness distribution, it is challenging to conduct efficient research only through experiments. In contrast, simulation can be an efficient way to optimize the electroplating experiments. Despite its potential, simulation has seen limited commercial use in the electroplating industry due to its inherent complexity and difficulty in achieving accurate precision for intricate geometries. The present study addresses the aspects that can enhance the electroplating simulation’s accuracy, which has been typically overlooked in the literature, such as the effect of current efficiency and its dependency on the current density, the input data for the electrode kinetics, the surface topology changes, and the differences between 2 and 3D simulations. The simulation model was validated by experimental results related to the coating thickness of Ni plating on a T-joint geometry. The results showed good agreement with the experimental ones, confirming the model’s ability to precisely predict the coating thickness and distribution and promote its broader utilization in the industry. Finally, the developed model was used to determine the optimal current density regime for achieving uniform coating thickness distribution on a T-joint sample.