Author:
Wang Yan,Lin Bin,Zhang Xiaofeng
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference26 articles.
1. Spur G, Holl SE (1997) Material removal mechanisms during ultrasonic-assisted grinding. Prod Eng 4(2):9–14
2. Wu YB, Nomura M, Feng ZJ, Kato M (2004) Modeling of grinding force in constant depth of cut ultrasonically assisted grinding. Mater Sci Forums 471–472:101–106
3. Qu W, Wang K, Miller MH, Huang Y, Chandra A (2000) Using vibration-assisted grinding to reduce subsurface damage. Precis Eng 24:329–337
4. Gong H, Fang FZ, Hua XT (2010) Kinematic view of tool life in rotary ultrasonic side milling of hard brittle materials. Int J Mach Tools Manuf 50(3):303–307
5. Komaraiah M, Narashima Reddy P (1991) Rotary ultrasonic machining—a new cutting process and its performance. Int J Prod Res 29(11):2177–2187
Cited by
35 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献