Using vibration-assisted grinding to reduce subsurface damage-Reference-Cited by-同舟云学术

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Using vibration-assisted grinding to reduce subsurface damage

Published:2000-10 Issue:4 Volume:24 Page:329-337
ISSN:0141-6359
Container-title:Precision Engineering
language:en
Short-container-title:Precision Engineering

Author:

Qu W,Wang K,Miller M.H,Huang Y,Chandra A

Publisher

Elsevier BV

Subject

General Engineering

Reference20 articles.

1. Eckert C, Weatherall J. Advanced ceramics: 90s global business outlook. Ceram Ind 1990;April:53–57.

2. Ductile regime grinding;Bifano;J Eng Industry,1991

3. A system approach for grinding of ceramics;Subramanian;Bull Am Ceram Soc,1994

4. Mechanisms of material removal in the precision production grinding of ceramics;Subramanian;ASME J Mfg Sci Eng,1997

5. Ashley S. High-speed machining goes mainstream. Mech Eng 1995;May:56–61.

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1. AAC theory for ultrasonic vibration-assisted grinding;The International Journal of Advanced Manufacturing Technology;2024-06-03

2. Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness;Materials Science in Semiconductor Processing;2024-03

3. Edge damage prediction and analysis of ceramic restorations in ultrasonic-assisted dental grinding based on a multi-grit finite element model;Journal of Manufacturing Processes;2023-09

4. Material removal mechanism and subsurface characteristics of silicon 3D nanomilling;International Journal of Mechanical Sciences;2023-03

5. Investigation on the machined surface quality and removal mechanism of SiCf/SiC composites in ultrasonic-assisted grinding;The International Journal of Advanced Manufacturing Technology;2022-11-19

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