Machining characteristics on the ultra-precision dicing of silicon wafer

Author:

Kim Sung-Chul,Lee Eun-Sang,Kim Nam-Hun,Jeong Hae-Do

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Reference6 articles.

1. Inasaki I (1999) Dicing of silicon wafer. In: Proceedings of the 1st EUSPEN International Conference, Bremen, Germany, May/June 1999, vol 1, pp 280–281

2. Tönshoff HK, Schmieden WV, Inasaki I, König W, Spur G (1990) Abrasive machining of silicon. Annals CIRP 39(2):621–635

3. Ikeno JL, Tani Y, Fukutani A (1991) Development of chipping-free dicing technology applying electrophoretic deposition of ultrafine abrasives. Annals CIRP 40(1):351–354

4. Miwa T, Inasaki I (1997) Blade wear and wafer chipping in dicing process. In: Proceedings of the Taiwan International Conference on Precision Engineering (ICPE’97), Taipei, Taiwan, November 1997, pp 399–400

5. Miyajima A, Inasaki I (1989) Precision cut off grinding with a diamond blade. Trans Japan Soc Mech Eng 56:212–216

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