Design and development of a new machine vision wire bonding inspection system

Author:

Perng Der-Baau,Chou Cheng-Chuan,Lee Shu-Ming

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Reference14 articles.

1. Orbotech Ltd., home page at http://www.orbotech.com . Camtek Ltd., home page at http://www.camtek.co.il . Firfax Systems Ltd., home page at http://www.firfaxsystems.co.uk

2. Perng D-B, Chou C-C, Lee S-M (2003) A new wire bonding inspection system by machine vision. In: Proceedings of the 7th International Conference on Automation Technology, National Chung Cheng University, Taiwan, May 2003, pp 228–233

3. Ahmed M, Cole CE, Jain RC, Rao AR (1990) INSPAD: a system for automatic bond pad inspection. IEEE Trans Semiconduct Manufact 3(3):145–147

4. Khotanzad A, Banerjee H, Srinath MD (1992) A vision system for inspection of ball bonds in integrated circuits. In: Proceedings of the IEEE Workshop on Applications of Computer Vision, Palm Springs, California, November/December 1992, pp 290–297

5. Khotanzad A, Banerjee H, Srinath MD (1994) A vision system for inspection of ball bonds and 2-D profile of bonding wires in integrated circuits. IEEE Trans Semiconduct Manufact 7(4):413–422

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3