Effect of heat input on failure mode and connection mechanism of parallel micro-gap resistance welding for copper wire-Reference-Cited by-同舟云学术

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Effect of heat input on failure mode and connection mechanism of parallel micro-gap resistance welding for copper wire

Published:2018-01-20 Issue:1-4 Volume:96 Page:299-306
ISSN:0268-3768
Container-title:The International Journal of Advanced Manufacturing Technology
language:en
Short-container-title:Int J Adv Manuf Technol

Author:

Cong S.,Zhang W. W.,Wang Y. S.,Wen Z. J.,Tian Y. H.

Funder

NSAF

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Link

http://link.springer.com/article/10.1007/s00170-018-1596-7/fulltext.html

Reference13 articles.

1. Zhong ZW (2009) Wire bonding using copper wire. Microelectron Int 26(1):10–16

2. Chauhan P, Zhong ZW, Pecht M (2013) Copper wire bonding concerns and best practices. J Electron Mater 42(8):2415–2433

3. Tian YH, Lum I,Won SJ, Park SH, Jung JP, Mayer M, Zhou Y (2005) Experimental study of ultrasonic wedge bonding with copper wire. In: proceeding of 6th International Conference on Electronics Packaging Technology, pp 389–393

4. Hong S, Hang C, Wang C (2005) Experimental research of copper wire ball bonding. In: Proceeding of 6th International Conference on Electronics Packaging Technology, pp 441–445

5. Tian YH, Wang CQ, Lum I, Mayer M, Jung JP, Zhou Y (2008) Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature. J Mater Process Technol 208(1):179–186. https://doi.org/10.1016/j.jmatprotec.2007.12.134

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