Experimental investigation of fabricating diamond abrasive layers by EDM

Author:

Ying Wei-Sheng,Han Fu-Zhu,Wang Jun-Hua

Funder

National Natural Science Foundation of China

Research Fund for the Doctoral Program of Higher Education of China

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering

Reference16 articles.

1. Sugawara J, Hara H, Mizoguchi A (2004) Development of fixed-abrasive-grain wire saw with less cutting loss. SEI Technical Review 58(7):7–11

2. Enomoto T, Shimazaki Y, Tani Y, Suzuki M, Kanda Y (1999) Development of a resinoid diamond wire containing metal powder for slicing a silicon ingot. CIRP Ann Manuf Technol 48(1):273–276

3. Chiba Y, Tani Y, Enomoto T, Sato H (2003) Development of a high-speed manufacturing method for electroplated diamond wire tools. CIRP Ann Manuf Technol 52(1):281–284

4. Suwabe H, Ishikawa K, Sakuma F, Uneda M (2000) A basic study on processing characteristics of diamond multi-wire saw by means of the workpiece rotation type. Proceedings of the 3rd international symposium on advances in abrasive technology, 229–232

5. Liu SX, Xiao B, Zhang ZY, Duan DZ (2016) Microstructural characterization of diamond/CBN grains steel braze joint interface using Cu-Sn-Ti active filler alloy. Int J Refract Met Hard Mater 54:54–59

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