Author:
Kejanli Haluk,Taşkin Mustafa,Kolukisa Sedat,Topuz Polat
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference11 articles.
1. Gomez JM, Mendez FJ, Urena A, Mellor BG (1997) TLP diffusion bonding of copper based SMA using silver interlayer. Scr Mater 37(6):861–867
2. Ishida A, Sato M, Ogawa K, Yamada K (2006) Shape memory behavior ot Ti–Ni–Cu thin films. Mater Sci Eng A 438–440:683–686. doi: 10.1016/j.msea.2006.02.154
3. Shiue RH, Wu SK (2006) Infrared brazing of Ti50Ni50 shape memory alloy using two Ag–Cu–Ti active braze alloys. Intermetallics 14:630–638
4. Lee CS, Li H, Chandel RS (1999) Vacuum-free diffusion bonding of aluminum metal matrix composite. J Mater Process Technol 89–90:326–330. doi: 10.1016/S0924-0136(99)00144-2
5. Ozan S, Taskin M, Kolukisa S (2006) The effect of the process temperature on the bondability in TLP diffusion bonding of AISI 430 stainless steel with nodular cast iron using a copper interlayer. Pract Metallogr 11:575–585
Cited by
16 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献