Author:
Tang Keyan,Kang Renke,Guo Dongming,Song Li
Publisher
Springer Science and Business Media LLC
Subject
Industrial and Manufacturing Engineering,Computer Science Applications,Mechanical Engineering,Software,Control and Systems Engineering
Reference18 articles.
1. Quirk M, Serda J (2004) Semiconductor manufacturing technology. Publishing House of Electronics Industry, Beijing
2. Liu ZJ, Zheng AS (2004) Semiconductor materials. Chemical Industry Press, Beijing
3. Guo DM, Kang RK, Jin ZJ (2003) High-productivity ultra-precise machining technique of silicon wafer with dia. over 300mm. World Manuf Eng Market 20(1):35–40
4. Pei ZJ, Xin XJ, Liu W (2003) Finite element analysis for grinding of wire-sawn silicon wafers: a designed experiment. Int J Mach Tool Manuf 43:7–16
5. Hsieh S, Hou KC (2006) Production-flow-value-based job dispatching method for semiconductor manufacturing. Int J Adv Manuf Technol 30(7–8):727–737
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献