Model for surface topography prediction in the ultra-precision grinding of silicon wafers considering volumetric errors
Author:
Funder
National Key Research and Development Program of China
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference45 articles.
1. A study on surface grinding of 300 mm silicon wafers;Pei;Int. J. Mach. Tool Manu.,2002
2. Research on the shape of ground wafer in Back Grinding of Wafer with Outer Rim;Guo;Mater. Sci. Semicond. Process.,2022
3. Effect of grinding residual height on the surface shape of ground wafer;Yao;J. Mater. Process. Technol.,2022
4. Fine grinding of silicon wafers: a mathematical model for the wafer shape;Sun;Int. J. Mach. Tool Manu.,2004
5. Fine grinding of silicon wafers: machine configurations for spindle angle adjustments;Sun;Int. J. Mach. Tool Manu.,2005
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