Fatigue Behavior and Mechanisms of High-Entropy Alloys
Author:
Funder
National Science Foundation
Army Research Office
Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s44210-022-00008-2.pdf
Reference150 articles.
1. S. Suresh, Fatigue of Materials, 2nd edn. (Cambridge University Press, Cambridge, 1998)
2. Q. Pan, H. Zhou, Q. Lu, H. Gao, L. Lu, History-independent cyclic response of nanotwinned metals. Nature 551, 214 (2017)
3. J.W. Yeh, S.K. Chen, S.J. Lin, J.Y. Gan, T.S. Chin, T.T. Shun, C.H. Tsau, S.Y. Chang, Nanostructured high-entropy alloys with multiple principal elements: novel alloy design concepts and outcomes. Adv. Eng. Mater. 6(5), 299–303 (2004)
4. B. Cantor, I. Chang, P. Knight, A. Vincent, Microstructural development in equiatomic multicomponent alloys. Mater. Sci. Eng. A 375, 213–218 (2004)
5. D.B. Miracle, O.N. Senkov, A critical review of high entropy alloys and related concepts. Acta Mater. 122, 448–511 (2017)
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