A CMOS compatible process for monolithic integration of high-aspect-ratio bulk silicon microstructures
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Computer Science
Link
http://link.springer.com/content/pdf/10.1007/s11432-014-5138-0.pdf
Reference14 articles.
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2. Smith J H, Montague S, Sniegowski J J, et al. Embedded micromechanical device for the monolithic integration of MEMS with CMOS. In: Proceedings of International Electron Devices Meeting, San Francisco, 1995. 609–612
3. Geen J A, Sherman S J, Chang J F, et al. Single-chip surface micromachined integrated gyroscope with 50°/h Allan deviation. IEEE J Solid-State Circuit, 2002, 37: 1860–1866
4. Fedder G K, Santhanam S, Reed M L. Laminated high-aspect ratio microstructures in a conventional CMOS process. In: Proceedings of IEEE Micro Electro Mechanical Systems Workshop, San Diego, 1996. 13–18
5. Xie H K, Zhu X, Gabriel K J, et al. Post-CMOS processing for high-aspect-ratio integrated silicon microstructures. J Microelectromech Syst, 2002, 11: 93–101
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