High-breakdown-voltage (>3000 V) and low-power-dissipation Al0.3Ga0.7N/GaN/Al0.1Ga0.9N double-heterostructure HEMTs with Ohmic/Schottky hybrid drains and Al2O3/SiO2 passivation
Author:
Publisher
Springer Science and Business Media LLC
Subject
General Computer Science
Link
https://link.springer.com/content/pdf/10.1007/s11432-022-3707-2.pdf
Reference5 articles.
1. Chowdhury N, Xie Q, Yuan M, et al. First demonstration of a self-aligned GaN p-FET. In: Proceedings of 2019 IEEE International Electron Devices Meeting Visions, San Francisco, 2019. 1–4
2. Shibata D, Kajitani R, Ogawa M, et al. 1.7 kV/1.0 mΩ · cm2 normally-off vertical GaN transistor on GaN substrate with regrown p-GaN/AlGaN/GaN semipolar gate structure. In: Proceedings of 2016 IEEE International Electron Devices Meeting Visions, San Francisco, 2016. 1–4
3. Lee H S, Piedra D, Sun M, et al. 3000-V 4.3-mΩ · cm2 InAlN/GaN MOSHEMTs with AlGaN back barrier. IEEE Electron Device Lett, 2012, 33: 982–984
4. Tang C, Xie G, Sheng K. Study of the leakage current suppression for hybrid-Schottky/Ohmic drain AlGaN/GaN HEMT. Microelectron Reliability, 2015, 55: 347–351
5. Zhang W, Fu L, Liu X, et al. In-situ-SiN/AlN/Al0.05Ga0.95N high electron-mobility transistors on Si-substrate using Al2O3/SiO2 passivation. IEEE J Electron Devices Soc, 2021, 9: 348–352
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