RF/wireless-interconnect: The next wave of connectivity-Reference-Cited by-同舟云学术

RF/wireless-interconnect: The next wave of connectivity

Published:2011-05 Issue:5 Volume:54 Page:1026-1038
ISSN:1674-733X
Container-title:Science China Information Sciences
language:en
Short-container-title:Sci. China Inf. Sci.

Author:

Tam SaiWang,Chang Mau-Chung Frank

Publisher

Springer Science and Business Media LLC

Subject

General Computer Science

Link

http://link.springer.com/content/pdf/10.1007/s11432-011-4225-8.pdf

Reference24 articles.

1. Forman G H, Zahorjan J The challenges of mobile computing. Computer, 1994, 27: 38–47

2. Satyanarayanan M. Mobile computing: the next decade. In: Proceedings of the 1st ACM Workshop on Mobile Cloud Computing and Services: Social Networks and Beyong, 2010

3. Chen S J, et al. Hardware Software Co-Design of a Multimedia SOC Platform. Berlin: Springer, 2009

4. Yeap G C F. Multi-design of architecture, circuit/device/process and package for cost-effective smart mobile devices: An integrated fabless manufacturer’s prespective. In: 2010 Symposium on VLSI Technology, 2010. 223–224

5. Kam D G, et al. Is 25 Gb/s on-board signaling viable? IEEE Trans Adv Packaging, 2009, 32: 328–344

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-loss wide-bandwidth planar transmission line with a laminated conductor;Science China Information Sciences;2023-04-20

2. RF transceiver and transmission line behavioral modeling in VHDL-AMS for wired RFNoC;Analog Integrated Circuits and Signal Processing;2017-04-25

3. Review of advanced CMOS technology for post-Moore era;Science China Physics, Mechanics and Astronomy;2012-11-29