Acceleration of epoxy resin curing by using a combination of aliphatic and aromatic amines
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Polymers and Plastics,Condensed Matter Physics,General Chemistry
Link
http://link.springer.com/content/pdf/10.1007/s00289-019-02815-x.pdf
Reference62 articles.
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3. Prime RB (1973) Differential scanning calorimetry of the epoxy cure reaction. J Polym Eng Sci 13:365–371. https://doi.org/10.1002/pen.760130508
4. Dang ZM, Zhang B, Li J, Zha JW, Hu GH (2012) Copper particles/epoxy resin thermosetting conductive adhesive using polyamide resin as curing agent. J Appl Polym Sci 126:815–821. https://doi.org/10.1002/app.36951
5. Han CH, Wang L, Zhao DY (2014) Curing process of epoxy resin using low molecular polyamide 651 as curing agent. Adv Mater Res 936:63–66. https://doi.org/10.4028/www.scientific.net/AMR.936.63
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