Author:
Prosviryakov A. S.,Samoshina M. E.,Popov V. A.
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanics of Materials,Condensed Matter Physics
Reference17 articles.
1. D. D. L. Chung, Materials for Electronic Packaging, Butterworth-Heinemann, Oxford (1995).
2. I. I. Kulakova, “Nanodiamond surface chemistry,” Fiz. Tverd. Tela, 46(4), 621 – 628 (2004).
3. K. Yoshida and H. Morigami, “Thermal properties of diamond copper composite material,” Microelectron. Reliab., 44(2), 303 – 308 (2004).
4. Th. Schubert, B. Trindade, T.Weißgärber, and B. Kieback, “ Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications,” Mat. Sci. Eng. A, No. 475 39 – 44 (2008).
5. C. Suryanarayana, “Mechanical alloying and milling,” Progr. Mater. Sci., 46, 1 – 184 (2001).
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