Features of Surface Micromachining and Wafer Bonding Process

Author:

Bag S. K.,Mainardi Daniela S.,Mahalik N. P.

Publisher

Springer-Verlag

Reference82 articles.

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3. Alley RL, Cuan GJ, Howe RT, Komvopoulos K (1988) The effect of release etch processing on surface microstructure stiction. echnical Digest of the Solid-State Sensor and Actuator Workshop, Hilton Head Island, pp 202–207

4. Allongue P, Kieling VC, Gerischer H (1993) Etching of Si in NaOH solutions, Part I and II, J. Electrochem. Soc. 40:1009–1018 and 40:1018-1026

5. Ammar ES, Rodgers TJ (1980) UMOS transistors on (110) silicon, IEEE Trans. Electron Devices ED-27:907–914

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