Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process-Reference-Cited by-同舟云学术

Eddy current measurement of the thickness of top Cu film of the multilayer interconnects in the integrated circuit (IC) manufacturing process

Published:2015-02-06 Issue:1 Volume:10 Page:1-6
ISSN:2095-0233
Container-title:Frontiers of Mechanical Engineering
language:en
Short-container-title:Front. Mech. Eng.

Author:

Qu Zilian,Meng Yonggang,Zhao Qian

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering

Link

http://link.springer.com/content/pdf/10.1007/s11465-015-0325-2.pdf

Reference12 articles.

1. Tanwar K, Canaperi D, Lofaro M, et al. BEOL Cu CMP process evaluation for advanced technology nodes. Journal of the Electrochemical Society, 2013, 160(12): D3247–D3254

2. Qu Z, Zhao Q, Meng Y, et al. In-situ measurement of Cu film thickness during the CMP process by using eddy current method alone. Microelectronic Engineering, 2013, 108: 66–70

3. Qu Z, Zhao Q, Meng Y. Improvement of sensitivity of eddy current sensors for nano-scale thickness measurement of Cu films. NDT & E International, 2014, 61: 53–57

4. Qu Z, Zhao Q, Meng Y. Characterization of submicronmeter thickness of copper film on silicon by using pulsed eddy currents method. In: Proceedings of 2011 International Conference on Electric Information and Control Engineering (ICEICE 2011). Wuhan, 2011, 1220–1223

5. Qu Z, Zhao Q, Yu Q, et al. Cu layer thickness monitoring in CMP process by using eddy current sensor. In: Proceedings of International Conference on Planarization/CMP Technology (ICPT 2012). Grenoble: VDE, 2012, 1–5

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