Author:
Chen Chao,Guo Hong,Chu Ke,Yin Fazhang,Zhang Ximing,Han Yuanyuan,Fan Yeming
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Reference22 articles.
1. Carl Z., Thermal materials solve power electronics challenges, Power Electron. Technol., 2006, 2: 40.
2. Masayuki M., Takeshi O., and Akio K., Characterization of fiber reinforced metal matrix composites fabricated by low-pressure infiltration process, Mater. Sci. Eng. A, 2005, 413–414: 521.
3. Miracle D.B., Metal-matrix composites: from science to technological significance, Compos. Sci. Technol., 2005, 65: 2526.
4. Huber T., Degischer H.P., Lefrance G., and Schmitt T., Thermal expansion studies on aluminum-matrix composites with different reinforcement architecture of SiC particles, Compos. Sci. Technol., 2006, 66: 2206.
5. Byung G.M., Dong, S.L., and Park S.D., Effects of thermal processing on thermal expansion coefficient of a 50 vol.% SiCp/Al composite, Mater. Chem. Phys., 2001, 72: 42.