1. German R.M., Hons K.F., and Johnson J.L., Powder metallurgy processing of thermal management materials for micro-electronic applications, Powder Metallurgy, 1994, 30(2): 205.
2. Johnson J.L., and German R.M., Processing of Mo-Cu for thermal management applications, International Journal of Powder Metallurgy, 1999, 35(8): 39.
3. Mu K.Q., and Kuang Y.G., The property and application of Mo-Cu composite, Metallic Functional Materials, 2002, 9(3): 26.
4. He Z., Research on preparation of Mo/Cu compounds, Electric Alloys, 2002, (2): 4.
5. Liu H.Y., and Li Z.F., Mo-Cu composite material prepared by mechanical alloy, Journal of Functional Materials, 2004, 35(3): 294.