Microstructure and properties of AgCu/2 wt% Ag-added Sn–Pb solder/CuBe joints fabricated by vapor phase soldering
Author:
Publisher
Springer Science and Business Media LLC
Subject
Materials Chemistry,Metals and Alloys,Physical and Theoretical Chemistry,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s12598-015-0545-y.pdf
Reference23 articles.
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2. Ouyang FY, Tu KN, Lai YS. Effect of electromigration induced joule heating and strain on microstructural recrystallization in eutectic SnPb flip chip solder joints. Mater Chem Phys. 2012;136(1):210.
3. Liang YC, Lin HW, Chen HP, Chen C, Tu KN, Lai YS. Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints. Scr Mater. 2013;69(1):25.
4. Smetana J. Theory of tin whisker growth: “the end game”. IEEE Trans Electron Packag. 2007;30(1):11.
5. Liu P, Yao P, Liu J. Effects of multiple reflows on interfacial reaction and shear strength of SnAgCu and SnPb solder joints with different PCB surface finishes. J Alloy Compd. 2009;470(1):188.
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