Wafer-level reliability characterization for wafer-level-packaged microbolometer with ultrasmall array size-Reference-Cited by-同舟云学术

Wafer-level reliability characterization for wafer-level-packaged microbolometer with ultrasmall array size

Published:2014-02-05 Issue:4-5 Volume:20 Page:889-897
ISSN:0946-7076
Container-title:Microsystem Technologies
language:en
Short-container-title:Microsyst Technol

Author:

Yang Chung Mo,Jung Ho,Park Jae Hong,Kim Hee Yeoun

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s00542-014-2072-4.pdf

Reference10 articles.

1. Alex Dommann, Antonia Neelsa et al (2011) Reliability in hermetic MEMS wafer level packaging. EPoSS Ann Forum. http://www.smart-systems-integration.org/public/documents/presentations/presentations-annual-Forum-2011/eposs-annualforum-2011-6-october-2011/session-3-smart-systems-andmanufacturing/3_Session3_Dommann_CSEM_Reliability%20in%20Hermetic%20MEMS%20Wafer%20Level%20Packaging.pdf

2. S Garcia-Blanco, P Topart, Y Desroches, JS Caron et al (2008) Low-temperature vacuum hermetic wafer-level package for uncooled microbolometer FPAs. In: Proceedings of SPIE 6884

3. Jérémie Dhennin (2011) Advanced techniques for NDT of MEMSdevices and WL packaging. Challenges for 3D systems Workshop

4. Jin-Shown Shie, Bruce CS Chou, Yeong-Maw Chen (1995) High performance Pirani vacuum gauge. J Vac Sci Technol A 13(6):2972–2975

5. Kim HY et al (2011) Mechanical Robustness of FPA in a-Si microbolometer with fine pitch. Sensors Transducers J 11:56–63

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