Fabrication of high precision microstructure using ICP etching for capacitive inclination sensor
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/content/pdf/10.1007/s00542-012-1548-3.pdf
Reference8 articles.
1. Abdolvand R, Ayazi F (2008) An advanced reactive ion etching process for very high aspect-ratio sub-micron wide trenches in silicon. Sens Actuators A 144:109–116
2. Beker EW, Ehrfeld W, Maner A, Munchmeyer D (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastic moulding (LIGA process). Microelectron Eng 4:35–56
3. Billat S, Gliosch H, Kunze M, Hedrich F, Frech J, Auber J, Sandmaier H, Lang W (2001) Micromachined inclinometer with high sensitivity and very good stability. Tech Papers Int Conf Solid State Sensors Actuators 1488–1491
4. Ishizawa N, Idei K, Kimura T, Noda D, Hattori T (2008) Resin micromachining by roller hot embossing. Microsyst Technol 14:1381–1388
5. Kohsaka F, Liang J, Ueda T (2005) High sensitive tilt sensor for quartz micromachining. In: Proceedings of the 22th sensor symp, pp 371–374
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