Yield analysis via induction of process statistics into the design of MEMS and other microsystems

Author:

Vudathu Shyam Praveen,Duganapalli Kishore Kumar,Laur Rainer,Kubalińska Dorota,Bunse-Gerstner Angelika

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference13 articles.

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2. Boning DS, McIlrath MB, Penfield P Jr., Sachs EM (1992) A general semiconductor process modeling framework. IEEE Trans Semi Manuf 5(4):266–280

3. Clark JV, Zhou N, Bindel D, Schenato L, Wu W, Demmel J, Pister KSJ (2000) 3D MEMS simulation modeling using modified nodal analysis. In: Proceedings of the microscale systems: mechanics and measurements symposium, Orlando, pp 68–75

4. Director S, Maly W, Strojwas A (1990) VLSI design for manufacturing: yield enhancement. Kluwer, USA

5. Jing Q, Fedder G (1998) NODAS 1.3—nodal design of actuators and sensors. In: Proceedings of 1998 IEEE/VIUF international workshop on behavioral modeling and simulation (BMAS ‘98), Orlando, FL, USA

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5. A Design Methodology for the Yield Enhancement of MEMS Designs with Respect to Process Induced Variations;2007 Proceedings 57th Electronic Components and Technology Conference;2007

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