Modeling of the Effect of Process Variations on a Micromachined Doubly-Clamped Beam
Author:
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Link
http://www.mdpi.com/2072-666X/8/3/81/pdf
Reference35 articles.
1. MEMS Materials and Processes Handbook;Reza Ghodssi,2011
2. Robust micro-rate sensor actuated by parametric resonance
3. Fabrication uncertainties and yield optimization in MEMS tunable capacitors
4. A high yield rate MEMS gyroscope with a packaged SiOG process
5. Maximum achievable aspect ratio in deep reactive ion etching of silicon due to aspect ratio dependent transport and the microloading effect
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